目次

TABLE OF CONTENTS

1 INTRODUCTION
1.1 OBJECTIVES OF THE STUDY
1.2 MARKET DEFINITION
1.3 MARKET SCOPE
1.3.1 MARKETS COVERED
1.3.2 YEARS CONSIDERED FOR THE STUDY
1.3.3 INCLUSIONS AND EXCLUSIONS
1.4 CURRENCY
1.5 LIMITATION
1.6 STAKEHOLDERS
1.6.1 IMPACT OF RECESSION

2 RESEARCH METHODOLOGY
2.1 RESEARCH DATA
2.1.1 SECONDARY DATA
2.1.1.1 Key Data from Secondary Sources
2.1.2 PRIMARY DATA
2.1.2.1 Key Data from Primary Sources
2.1.2.2 Key Industry Insights
2.1.2.3 Breakdown of Primary Interviews
2.2 MARKET SIZE ESTIMATION
2.3 DATA TRIANGULATION
2.4 IMPACT OF RECESSION
2.5 RESEARCH ASSUMPTIONS

3 EXECUTIVE SUMMARY

4 PREMIUM INSIGHTS

5 MARKET OVERVIEW
5.1 INTRODUCTION
5.2 MARKET DYNAMICS
5.2.1 DRIVERS
5.2.2 RESTRAINTS
5.2.3 OPPORTUNITIES
5.2.4 CHALLENGES
5.3 TRENDS/DISRUPTIONS IMPACTING CUSTOMER’S BUSINESS
5.4 PRICING ANALYSIS
5.4.1 AVERAGE SELLING PRICE TREND, BY REGION
5.4.2 INDICATIVE PRICING ANALYSIS BY PRODUCT TYPE
5.5 SUPPLY/VALUE CHAIN ANALYSIS
5.6 INVESTMENT AND FUNDING SCENARIO
5.7 FUNDING BY USE-CASE APPLICATION
5.8 ECOSYSTEM/MARKET MAP
5.9 TECHNOLOGY ANALYSIS
5.1 PATENT ANALYSIS
5.11 TRADE ANALYSIS
5.12 KEY CONFERENCES AND EVENTS IN 2024-2025
5.13 REGULATORY LANDSCAPE
5.13.1 REGULATORY BODIES, GOVERNMENT AGENCIES AND OTHER ORGANIZATIONS
5.13.2 SEMICONDUCTOR AND IC PACKAGING MATERIALS MARKET-GLOBAL FORECAST TO 2028
5.13.2.1 North America
5.13.2.2 US
5.13.2.3 Canda
5.13.2.4 Europe
5.13.2.5 Asia Pacific
5.14 PORTER’S FIVE FORCES’ ANALYSIS
5.14.1 THREAT OF NEW ENTRANTS
5.14.2 THREAT OF SUBSTITUTES
5.14.3 BARGAINING POWER OF SUPPLIERS
5.14.4 BARGAINING POWER OF BUYERS
5.14.5 INTENSITY OF COMPETITION RIVALRY
5.15 KEY STAKEHOLDERS AND BUYING CRITERIA
5.15.1 KEY STAKEHOLDERS IN THE BUYING PROCESS
5.15.2 BUYING CRITERIA
5.16 CASE STUDY ANALYSIS
5.17 MACRO-ECONOMIC ANALYSIS

6 SEMICONDUCTOR & IC PACKAGING MATERIAL MARKET, BY TYPE - FORECAST TILL 2028
6.1 INTRODUCTION
6.2 ORGANIC SUBSTRATES
6.3 BONDING WIRES
6.4 LEADFRAMES
6.5 ENCAPSULATION RESNS
6.6 CERAMIC PACKAGES
6.7 DIE ATTACH MATERIALS
6.8 THERMAL INTERFACE MATERIALS
6.9 SOLDER BALLS
6.1 OTHERS

7 SEMICONDUCTOR & IC PACKAGING MATERIAL MARKET, BY PACKAGING TECHNOLOGY- FORECAST TILL 2028
7.1 INTRODUCTION
7.2 SOP
7.3 GA
7.4 QFN
7.5 DFN
7.6 QFP
7.7 DIP
7.8 OTHERS

8 SEMICONDUCTOR & IC PACKAGING MATERIAL MARKET, BY END USE INDUSTRY- FORECAST TILL 2028
8.1 INTRODUCTION
8.2 CONSUMER ELECTRONICS
8.3 AUTOMOTIVE
8.4 HEALTHCARE
8.5 IT & TELECOMMUNICATION
8.6 AEROSPACE AND DEFENSE
8.7 OTHERS

9 SEMICONDUCTOR & IC PACKAGING MATERIAL MARKET, BY REGION - FORECAST TILL 2028
9.1 INTRODUCTION
9.2 NORTH AMERICA
9.2.1 IMPACT OF RECESSION
9.2.2 US
9.2.3 CANADA
9.2.4 MEXICO
9.3 ASIA PACIFIC
9.3.1 IMPACT OF RECESSION
9.3.2 CHINA
9.3.3 INDIA
9.3.4 JAPAN
9.3.5 TAIWAN
9.3.6 SOUTH KOREA
9.3.7 REST OF ASIA PACIFIC
9.4 EUROPE
9.4.1 IMPACT OF RECESSION
9.4.2 GERMANY
9.4.3 FRANCE
9.4.4 ITALY
9.4.5 UK
9.4.6 SPAIN
9.4.7 REST OF EUROPE
9.5 SOUTH AMERICA
9.5.1 IMPACT OF RECESSION
9.5.2 BRAZIL
9.5.3 ARGENTINA
9.5.4 REST OF SOUTH AMERICA
9.6 MIDDLE EAST & AFRICA
9.6.1 IMPACT OF RECESSION
9.6.2 UAE
9.6.3 REST OF GCC COUNTRIES
9.6.4 ISRAEL
9.6.5 SOUTH AFRICA
9.6.6 REST OF MIDDLE EAST & AFRICA
*Note: This is a tentative list of countries that may change during study

10 COMPETITIVE LANDSCAPE
10.1 OVERVIEW
10.2 KEY PLAYER STRATEGIES/RIGHT TO WIN
10.3 REVENUE ANALYSIS
10.3.1 REVENUE ANALYSIS OF TOP 5 MARKET PLAYERS
10.4 MARKET SHARE ANALYSIS
10.4.1 MARKET RANKING OF TOP 5 KEY PLAYERS
10.5 COMPANY EVALUATION MATRIX, KEY PLAYERS, 2023
10.5.1 STARS
10.5.2 EMERGING LEADERS
10.5.3 PERVASIVE PLAYERS
10.5.4 PARTICIPANTS
10.5.5 COMPANY FOOTPRINT:KEY PLAYERS, 2023
10.5.5.1 Company Footprint
10.5.5.2 Region Footprint
10.5.5.3 Type Footprint
10.5.5.4 Application Footprint
10.6 COMPANY EVALUATION MATRIX: STARTUPS/SMES, 2023
10.6.1 PROGRESSIVE COMPANIES
10.6.2 RESPONSIVE COMPANIES
10.6.3 DYNAMIC COMPANIES
10.6.4 STARTING BLOCKS
10.6.5 COMPETITIVE BENCHMARKING:STARTUPS/SMES, 2023
10.6.5.1 Detailed List of Key Startups/SMEs
10.6.5.2 Competitive Benchmarking of Key Startups/SMEs
10.7 COMPANY VALUATION
10.8 FINANCIAL METRICS
10.9 BRAND/ PRODUCT COMPARISON
10.1 COMPETITIVE SCENARIO AND TRENDS
10.10.1 EXPANSIONS & INVESTMENTS
10.10.2 AGREEMENTS, COLLABORATIONS, AND JOINT VENTURES
10.10.3 NEW PRODUCT LAUNCHES
10.10.4 MERGERS & ACQUISITIONS

11 COMPANY PROFILE
11.1 MACDERMID, INC.
11.1.1 BUSINESS OVERVIEW
11.1.2 PRODUCTS/SOLUTIONS/SERVICES OFFERED
11.1.3 RECENT DEVELOPMENTS
11.1.4 MNM VIEW
11.1.4.1 Key Strengths/Right to Win
11.1.4.2 Strategic Choice Made
11.1.4.3 Weaknesses and Competitive Threats
11.2 LG CHEM
11.2.1 BUSINESS OVERVIEW
11.2.2 PRODUCTS/SOLUTIONS/SERVICES OFFERED
11.2.3 RECENT DEVELOPMENTS
11.2.4 MNM VIEW
11.2.4.1 Key Strengths/Right to Win
11.2.4.2 Strategic Choice Made
11.2.4.3 Weaknesses and Competitive Threats
11.3 AMKOR TECHNOLOGY
11.3.1 BUSINESS OVERVIEW
11.3.2 PRODUCTS/SOLUTIONS/SERVICES OFFERED
11.3.3 RECENT DEVELOPMENTS
11.3.4 MNM VIEW
11.3.4.1 Key Strengths/Right to Win
11.3.4.2 Strategic Choice Made
11.3.4.3 Weaknesses and Competitive Threats
11.4 POWERTECH TECHNOLOGY INC.
11.4.1 BUSINESS OVERVIEW
11.4.2 PRODUCTS/SOLUTIONS/SERVICES OFFERED
11.4.3 RECENT DEVELOPMENTS
11.4.4 MNM VIEW
11.4.4.1 Key Strengths/Right to Win
11.4.4.2 Strategic Choice Made
11.4.4.3 Weaknesses and Competitive Threats
11.5 TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMITED
11.5.1 BUSINESS OVERVIEW
11.5.2 PRODUCTS/SOLUTIONS/SERVICES OFFERED
11.5.3 RECENT DEVELOPMENTS
11.5.4 MNM VIEW
11.5.4.1 Key Strengths/Right to Win
11.5.4.2 Strategic Choice Made
11.5.4.3 Weaknesses and Competitive Threats
11.6 HENKEL AG & CO. KGAA
11.7 KYOCERA CORPORATION
11.8 ASE
11.9 SILICONWARE PRECISION INDUSTRIES CO., LTD. (SPIL)
11.1 IBIDEN CO., LTD
11.11 OTHER KEY 15 PLAYERS
*Note: This is a tentative list of companies, and it may change during study. Financial will only be provided for listed companies.

12 APPENDIX
12.1 INSIGHTS FROM INDUSTRY EXPERTS
12.2 DISCUSSION GUIDE
12.3 AVAILABLE CUSTOMIZATIONS
12.4 CONNECTED MARKET
12.5 RELATED REPORTS